Understanding Spin Coating in Semiconductors

What is Spin Coating?

Spin coating is a process used in the semiconductor industry to create thin, uniform layers of material on a substrate, such as a silicon wafer. During spin coating, a liquid material is deposited on the surface of the wafer, which is then rapidly spun. The spinning motion spreads the liquid across the surface evenly, creating a thin film as the excess material is flung off the edges.

Applications of Spin Coating

This technique is commonly used for applying photoresists, which are essential for creating patterns on wafers in the photolithography process. It is also used for coating materials like polymers, oxides, or even biological substances in various research and industrial applications.

Research Requests

What is Dip Silicon Surface?

Answer: A dip silicon surface refers to a silicon substrate that has undergone dip coating. Dip coating is a process where a substrate is immersed in a liquid solution and then withdrawn at a controlled speed to form a uniform thin film on its surface. This technique is often used for depositing organic, polymer, or oxide layers for research or industrial applications.

New Customer Request: "In addition to the list of samples you have provided, ideally it would be great if you could please guide us on the following:

  • 1 side polished only;
  • Our work will be looking at dip coated or spin coated surfaces (i.e., a dry organic layer on the Si wafer);
  • Thicker wafers that aren't on this list would suit;
  • Are more highly conductive Si (< 0.01 Ohm cm) available?;
  • Ideally we wish to avoid B-doped Si;
  • For X-ray reflectivity, 380 micron thickness is not ideal: 500 micron or 1000 micron is best. It depends on whether the film might bend the wafer slightly, which would cause the surface to no longer be flat. Thoughts please?

Answer: Based on your requirements:

  • We can provide wafers with single-side polish as per your specifications.
  • DSP (Double-Side Polished) silicon wafers or single-side polished wafers are both suitable for spin or dip coating applications.
  • We can offer thicker wafers, including 500 micron and 1000 micron options.
  • Highly conductive silicon wafers (< 0.01 Ohm cm) are available.
  • We also have options to avoid boron-doped (B-doped) silicon, such as phosphorus-doped or intrinsic silicon wafers.
  • Regarding X-ray reflectivity, a 500 micron or 1000 micron wafer is recommended to minimize bending and ensure surface flatness.

We would be happy to provide additional details or custom specifications to suit your project needs.

University of Tennessee Food Science Department: "We purchased some UniversityWafer, Inc. Silicon wafers a few years ago to use for spin-coating applications. We would like to order some more, but we were wondering if there was any way to purchase wafers pre-cut into 2 cm by 2 cm squares."

Reference #91668

Center for X-ray Optics & Medical Applications: "Si Item #UW3MEC: 3-inch wafer, orientation (111), thickness 380 micrometer, resistivity 0-100 ohm-cm, Mechanical Grade for Spin Coating. Please let me know how much it costs to me?"

Reference #90837

Solid-State Researcher: "I need silicon wafers for use in spin coating thin, uniform polystyrene films. They should be as flat as possible, with low surface roughness. Thickness doesn't really matter, as long as it is flat and smooth."

Answer: For your application, we recommend using DSP (Double-Side Polished) silicon wafers. These wafers are designed for high flatness and minimal surface roughness, making them ideal for spin coating uniform thin films. Please contact us for specifications and pricing tailored to your needs.

Reference #96579 for more info.

If you have similar requests, feel free to reach out to us for custom quotes and detailed specifications!